Electronics hpe dip shapraw ai
Printed Electronics & Flexible devices ni a matu tau hkrau hkyen lajang ai lam hpe tsi lajang ai lam
Plasma ntsa na n-gun hpe jat ya ai gaw, lang ai hkam sha lam ni hpe kam mai ai hku n-gun jat ya lu ai:
- Flexible Printed Circuit (FPCs){0}} hpe galaw ai shaloi, n-gun rawng ai n-gun rawng ai n-gun rawng ai (PI) hte PET sumla hkrung ni hpe galaw nna, conductive ink bonding
- OLED/LCD Displays - ultra-thin glass (UTFG) hte ITO coating ni hpe shawng tsi lajang ai.
- Thin- Film Batteries - Li-ion electrode foils ni hpe n-gun jaw ai lam
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Ning dat ai |
Plasma hpaji jaw ai lam |
Hpaji masa akyu |
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Ntsa na n-gun n law ai polymers ni |
Oxygen/Argon/plasma ni gaw hydroxyl ({0}}OH) & carboxyl ({1}}COOH) hpung ni hpe bang da ai |
1990 ning hta 80℃→30℃kaw nna angle hpe matut mahkai na<1s |
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Discharge-ssen hpe hkam sha lu ai arung arai ni |
Pulsed DBD plasma hta<50°C prevents thermal damage |
Nanoscale galai shai ai lam (<10nm depth) only |
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UTFG kaw na adhesion n lu ai |
DCSBD plasma gaw hydrocarbons hpe shaw kau nna, oxygen bungli ni hpe jat bang ya ai. |
10⁵× n-gun shayawm ai lam hpe rGO circuits ni hta shayawm ai |
Material- Ahkyak ai ladat ni
- Polyimide sumla ni (Kapton®)
Ladat: 20kHz hta N/H 1 plasma, 7kV .
Mahtai: 60% grau law ai ink adhesion hte corona tsi ladat
- Ultra-Thin Glass (UTFG)
Ladat: Coplanar a npu na n-gun n bung ai lam (DCSBD)
Mahtai: PEDOT:PSS coatings hta 40% conductivity jat wa ai
- Li-ion Electrode foils
Ladat: Shi/O kaji kayau ai nbung laru a plasma
Mahtai: Laminated cells ni hta 15% grau law ai peel n-gun dat n-gun
- Engineer- Num ni a matu hkyen lajang ai lam ni a matu hkyen lajang ai wa a matu n-gun jaw ai lam ni
Anhte a system ni gaw, n-gun n rawng ai hpe pat shingdang na matu, tengman ai- aten hpe pat shingdang ai lam hpe yu reng ai lam hte galai shai ai atsam hpe hkang ai lam ni hpe hpawng de da ai:
Temperature-sens hpe hkam sha chye ai bio-.
Micro- n-gun jaw ai ITO ntsa lam ni
Bat battery garan ginhka ai lam amyu myu
- Anhte a lam hpe chye lu na matu tsun mayu ai:
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